Parallella Community

I was wondering if anyone at Adapteva has an Epiphany (III or IV) die shot with labelled components that they would be willing to share. It would be interesting to see the design/layout and the die space tradeoffs for the core, memory, and network.

Shot dead , that wouldn't be good. Ah, *chip* die shot...

You can find some virtual die shots at our flicr stream:
http://www.flickr.com/photos/parallella/

Actual die shots are very expensive to get. We basically block the whole die with upper layer metals. To get good pictures we would either need to etch away the upper layers or pull out the wafers before upper metal layers are done. Maybe some day when we become bigger...

To summarize, out of 10mm^2 for a 64 core chip at 28nm, approximately:
2mm^2 for IO
4mm^2 for memory
The remaining 40% is split between the following components: register file(big), FPU(big), NOC, memory cross-bar, "stuff".

Andreas